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EIA Standards Projects
Engineering Active Projects Standards
The following are active standards projects. Comments may be submitted to emikoski@eciaonline.org
| Project Number: | Title | Initiation Date | Committee | Reserved Final Publication Number: | Status |
| PN-5291 | Specification for Mini Multilane 10 Gb/s 4X Shielded Receptacle Shell and Plug | 02/25/2013 | CE-2.0 | EIA-976 | |
| PN-5290 | Specification for Mini Multilane 10 Gb/s 4X Unshielded Receptacle Shell and Plug | 02/25/2013 | CE-2.0 | EIA-975 | |
| PN-5289 | Specification for Mini Multilane 10 Gb/s 4X Common Elements Connectors |
02/25/2013 | CE-2.0 | EIA-974 | |
| PN-5288 | Glossary of Electrical Connector Related Terms | 01/16/2013 | CE-2.0 | EIA-622-A | |
| PN-5287 | Spring Finger Force Test Procedure for Circular Connectors | 10/17/2012 | CE-2.0 | EIA-364-64 | |
| PN-5256 | Fixed Capacitors for Use in Electronic Equipment - Part 2: Sectional Specification - Fixed Metallized Polyethylene Terephthalate Film Dielectric d.c. Capacitors | 10/3/2012 | P-2.5 | EIA-757 | |
| PN-5257 | Fixed Capacitors for Use in Electronic Equipment - Part 3: Sectional Specification: Surface Mount Fixed Tantalum Electrolytic Capacitors with Manganese Dioxide Solid Electrolyte | 10/3/2012 | P-2.2 | EIA-797 | |
| PN-5258 | Fixed Capacitors for Use in Electronic Equipment - Part 4: Sectional Specification - Aluminium Electrolytic Capacitors with solid (MnO<sub>2</sub>) and non-solid electrolyte | 10/3/2012 | P-3 | EIA-958 | |
| PN-5259 | Fixed Capacitors for Use in Electronic Equipment - Part 8: Sectional Specification: Fixed Capacitors of Ceramic Dielectric, Class 1 | 10/3/2012 | P-3 | EIA-944 | |
| PN-5260 | Fixed Capacitors for Use in Electronic Equipment - Part 9: Sectional Specification: Fixed Capacitors of Ceramic Dielectric, Class 2 | 10/3/2012 | P-3 | IS-692 | |
| PN-5261 | Fixed Capacitors for Use in Electronic Equipment - Part 11: Sectional Specification - Fixed Polyethylene Terephthalate Film Dielectric Metal Foil d.c. Capacitors | 10/3/2012 | P-3 | EIA-483 | |
| PN-5262 | Fixed Capacitors for Use in Electronic Equipment - Part 12: Sectional Specification: Fixed Polycarbonate Film Dielectric Metal Foil d.c. Capacitors | 10/3/2012 | P-2.1 | EIA-198-2 | |
| PN-5263 | Fixed Capacitors for Use in Electronic Equipment - Part 13: Sectional Specification - Fixed Polypropylene Film Dielectric Metal Foil d.c. Capacitors | 10/3/2012 | ACH | EIA-468-C | |
| PN-5264 | Fixed Capacitors for Use in Electronic Equipment. Part 15: Sectional Specification: Fixed Tantalum Capacitors with Non-Solid or Solid Electrolyte | 10/3/2012 | ACH | EIA-704 | |
| PN-5265 | Fixed Capacitors for Use in Electronic Equipment - Part 16: Sectional Specification: Fixed Metallized Polypropylene Film Dielectric d.c. Capacitors | 10/3/2012 | P-2.5 | EIA-60384-26 | |
| PN-5266 | Fixed Capacitors for Use in Electronic Equipment - Part 17: Sectional Specification: Fixed Metallized Polypropylene Film Dielectric a.c. and Pulse Capacitors | 10/3/2012 | P-2.5 | EIA-60384-26-1 | |
| PN-5267 | Fixed Capacitors for Use in Electronic Equipment - Part 18: Sectional Specification - Fixed Aluminium Electrolytic Surface Mount Capacitors with solid (MnO2) and non-solid electrolyte | 10/3/2012 | P-2.5 | EIA-60384-25 | |
| PN-5268 | Fixed Capacitors for Use in Electronic Equipment - Part 19: Sectional Specification - Fixed Metallized polyethylene-terephthalate Film dielectric Surface Mount d.c. Capacitors | 10/3/2012 | P-2.5 | EIA-60384-25-1 | |
PN-5269 |
Fixed Capacitors for Use in Electronic Equipment - Part 20: Sectional Specification - Fixed Metallized polyphenylene sulfide Film dielectric Surface Mount d.c. Capacitors | 10/3/2012 | P-2.5 | EIA-60384-24 | |
| PN-5270 | Fixed Capacitors for Use in Electronic Equipment - Part 21: Sectional Specification - Fixed Surface Mount multilayer Capacitors of ceramic dielectric, Class 1 | 10/3/2012 | P-2.2 | EIA-60384-23 | |
| PN-5271 | Fixed Capacitors for Use in Electronic Equipment - Part 22: Sectional Specification - Fixed Surface Mount multilayer Capacitors of ceramic dielectric, Class 2 | 10/3/2012 | P-2.1 | EIA-60384-22 | |
| PN-5272 | Fixed Capacitors for Use in Electronic Equipment - Part 23: Sectional Specification - Fixed Surface Mount Metallized polyethylene naphthalate Film dielectric DC Capacitors | 10/3/2012 | P-2.1 | EIA-60384-21 | |
| PN-5273 | Fixed Capacitors for Use in Electronic Equipment - Part 24: Sectional Specification - Surface Mount fixed tantalum Electrolytic Capacitors with conductive polymer solid electrolyte | 10/3/2012 | P-2.2 | EIA-60384-20 | |
| PN-5274 | Fixed Capacitors for Use in Electronic Equipment - Part 25-1: Blank detail Specification - Surface Mount fixed aluminum Electrolytic Capacitors with conductive polymer solid electrolyte - Assessment level EZ | 10/3/2012 | P-2.2 | EIA-60384-19 | |
| PN-5275 | Fixed Capacitors for Use in Electronic Equipment - Part 25: Sectional Specification - Surface Mount fixed Aluminium Electrolytic Capacitors with conductive polymer solid electrolyte | 10/3/2012 | P-2.2 & P-2.5 | EIA-60384-18 | |
| PN-5276 | Fixed Capacitors for Use in Electronic Equipment - Part 26-1: Blank detail Specification - Fixed Aluminium Electrolytic Capacitors with conductive polymer solid electrolyte - Assessment level EZ | 10/3/2012 | P-2.2 | EIA-60384-17 | |
| PN-5277 | Fixed Capacitors for Use in Electronic Equipment - Part 26: Sectional Specification - Fixed Aluminium Electrolytic Capacitors with conductive polymer solid electrolyte | 10/3/2012 | P-2.2 | EIA-60384-16 | |
| PN-5278 | 72 mm through 200 mm Carrier Tapes for Packaging Components for Automatic Handling | 10/4/2012 | P-2.5 | EIA-60384-15 | |
| PN-5279 | Lead Taping of Components in the Radial Configuration for Automatic Handling | 10/4/2012 | P-2.2 | EIA-60384-13 | |
| PN-5280 | Ceramic Dielectric Capacitors Classes I, II, III and IV - Part II: Test Methods | 10/3/2012 | P-2.2 | EIA-60384-12 | |
| PN-5281 | Standard Method of Test for Effective Series Resistance (ESR) and Capacitance of Multilayer Ceramic Capacitors at High Frequencies | 10/3/2012 | P-2.2 | EIA-60384-11 | |
| PN-5282 | Ceramic Capacitor Qualification Specification | 10/3/2012 | P-2.1 | EIA-60384-9 | |
| PN-5283 | Surface Mount Chip Bead Qualification Specification | 10/3/2012 | P-2.1 | EIA-60384-8 | |
| PN-5284 | Surface Mount Common Mode Choke Qualification Specification | 10/3/2012 | P-2.2 & P-2.5 | EIA-60384-4 | |
| PN-5285 | Aluminum-Electrolytic Capacitor Application Guideline | 10/3/2012 | P-2.5 | EIA-60384-3 | |
| PN-5286 | Visual and Mechanical Inspection for Molded SMT Solid Tantalum Capacitors | 10/3/2012 | P-2.2 | EIA-60384-2 | |
| PN-5255 | Solid Tantalum Capacitor Application Guideline | 10/3/2012 | P-2.5 | EIA-809 | |
| PN-5254 | Adhesive Backed punched plastic carrier taping of singulated bare die and other surface mount components for automatic handling of devices generally less than 1.0mm thick | 08/16/2012 | ACH | EIA-747B | |
| PN-5253.01 | EMI Shielding Effectiveness Test Procedure for Electrical Connectors | 08/13/2012 | CE-2.0 | EIA-364-66A | |
| PN-5253.02 | Temperature Rise Versus Current Test Procedure for Electrical Connectors and Sockets | 08/13/2012 | CE-2.0 | EIA-364-70B | |
| PN-5253.03 | Shell-to-Shell and Shell-to-Bulkhead Resistance Test Procedure for Electrical Connectors | 08/13/2012 | CE-2.0 | EIA-364-83 | |
| PN-5253.04 | Crosstalk Ratio Test Procedure for Electrical Connectors, Cable Assemblies or Interconnection Systems | 08/13/2012 | CE-2.0 | EIA-364-90 | |
| PN-5253.05 | Attenuation Test Procedure for Electrical Connectors, Sockets, Cable Assemblies or Interconnection Systems | 08/13/2012 | CE-2.0 | EIA-364-101 | |
| PN-5253.06 | Standing Wave Ratio (SWR) Test Procedure for Electrical Connectors | 08/13/2012 | CE-2.0 | EIA-364-106 | |
| PN-5253.07 | Eye Pattern and Jitter Test Procedure for Electrical Connectors, Sockets, Cable Assemblies or Interconnection Systems | 08/13/2012 | CE-2.0 | EIA-364-107 | |
| PN-5253.08 | Impedance, Reflection Coefficient, Return Loss, and VSWR Measured in Time and Frequency Domain Test Procedure for Electrical Connectors, Cable Assemblies or Interconnection Systems | 08/13/2012 | CE-2.0 | EIA-364-108 | |
| PN-5253.09 | Thermal Cycling Test Procedure for Electrical Connectors and Sockets | 08/13/2012 | CE-2.0 | EIA-364-110 | |
| PN-5252.01 | Acceleration Test Procedure for Electrical Connectors | 08/13/2012 | CE-2.0 | EIA-364-01B | |
| PN-5252.02 | Contact Axial Concentricity Test Procedure for Electrical Connectors | 08/13/2012 | CE-2.0 | EIA-364-07C | |
| PN-5252.03 | Visual and Dimensional Inspection Test Procedure for Electrical Connectors and Sockets | 08/13/2012 | CE-2.0 | EIA-364-18B | |
| PN-5252.04 | Simulated Life Test Procedure for Electrical Connectors | 08/13/2012 | CE-2.0 | EIA-364-22B | |
| PN-5252.05 | Spray Salt Test Procedure for Electrical Connectors and Sockets | 08/13/2012 | CE-2.0 | EIA-364-26B | |
| PN-5252.06 | Contact Retention Test Procedure for Electrical Connectors | 08/13/2012 | CE-2.0 | EIA-364-29C | |
| PN-5252.07 | Determination of Gas-Tight Characteristics Test Procedure for Electrical Connectors, and or Contact Systems | 08/13/2012 | CE-2.0 | EIA-364-36B | |
| PN-5252.08 | Hydrostatic Test Procedure for Electrical Connectors, Contacts and Sockets | 08/13/2012 | CE-2.0 | EIA-364-39B | |
| PN-5252.09 | Cable Clamping (Bending Moment) Test Procedure for Electrical Connectors | 08/13/2012 | CE-2.0 | EIA-364-43B | |
| PN-5252.10 | Low Temperature Test Procedure for Electrical Connectors and Sockets | 08/13/2012 | CE-2.0 | EIA-364-59A | |
| PN-5251 | High Voltage Ceramic Capacitors, Conformally Coated and Multilayer Surface Mount | 07/02/2012 | P-2.1 | EIA-198-3-9-F | |
| PN-5250 | Application Guide for Multilayer Ceramic Capacitors - Electrical | 06/29/2012 | P-2.1 | EIA-521-A | |
| PN-5249 | Product Discontinuance | 05/22/2012 | S-1 | JS48D | |
| PN-5248 | Customer Notification of Product/Process Changes by Solid State Suppliers | 05/22/2012 | S-1 | JS46E | |
| PN-5247 | Half Rack Standard | 05/04/2012 | CE-5.0 | TBA | |
| PN-5246 | Back Adopt IEC 60384-1 | 04/05/2012 | P-2.2 | EIA-60384-1 | |
| PN-5245 | Manual of Org & Procedures | 03/23/2012 | ESC | EIA-EP-20C | |
| PN-5244 | Passive Components Chap iNEMI 2013 Roadmap | 03/23/2012 | ESC | iNEMI Roadmap | |
| PN-5243 | Classification of Non-IC Electronic Components for Assembly Processes | 03/22/2012 | S-1 | J-Std-075 | |
| PN-5242 | Resistors, Rectangular, Surface Mount Precision | 03/22/2012 | P-1 | EIA-576B | |
| PN-5241 | Specification for M12 Hybrid (Data and Power) Circular Connector | 03/14/2012 | CE-2.0 | EIA-973 | |
| PN-5240 | Specification for M12 Power Circular Connector | 03/14/2012 | CE-2.0 | EIA-972 | |
| PN-5239 | Accessory Thread Strength TP for Circular Connectors | 02/07/2012 | CE-2.0 | 364-63 | |
| PN-5238 | Firewall Flame Test Procedure | 10/28/2011 | CE-2.0 | 364-45C | |
| PN-5237 | 4mm Micro Carrier Tape | 10/20/2011 | ACH | EIA-971 | |
| PN-5236.18 | Interim Detail Specification for 2.5 mm Two Part Connector for Use in Electronic Equipment | 09/28/2011 | CE-2.0 | EIA-IS-84 | |
| PN-5236.17 | Contact Termination Finish Standard for Surface Mount Devices | 09/28/2011 | CE-2.0 | EIA-IS-47 | |
| PN-5236.16 | Recommended Test Procedure for Semiconductor Thermal Dissipating Devices-Addendum to CB5 | 09/28/2011 | CE-2.0 | EIA-CB-5-1 | |
| PN-5236.15 | Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment | 09/28/2011 | CE-2.0 | EIA-540GAAA | |
| PN-5236.14 | Detail Specification for Multi-Package 50 Mil Pitch, Angled Mounting Format Module Sockets for Use in Electronic Equipment | 09/28/2011 | CE-2.0 | EIA-540FAAD | |
| PN-5236.13 | Detail Specification for Multi-Package 50 Mil Pitch, Vertical Mounting Format Module Sockets for Use in Electronic Equipment | 09/28/2011 | CE-2.0 | EIA-540FAAC | |
| PN-5236.12 | Detail Specification for Multi-Package 100 Mil Pitch, Angled Mounting Format Module Sockets for Use in Electronic Equipment | 09/28/2011 | CE-2.0 | EIA-540FAAB | |
| PN-5236.11 | Detail Specification for Multi-Package 100 Mil Pitch, Vertical Mounting Format Module Sockets for Use in Electronic Equipment | 09/28/2011 | CE-2.0 | EIA-540FAAA | |
| PN-5236.10 | Detail Specification for Decoupling Capacitor Dual In-Line Package Sockets for Use in Electronic Equipment | 09/28/2011 | CE-2.0 | EIA-540DBAA | |
| PN-5236.09 | Detail Specification for Mechanically Actuated (Zero and Low Insertion Force) Sockets for Pin Grid Array Devices | 09/28/2011 | CE-2.0 | EIA-540BAAA | |
| PN-5236.08 | Detail Specification for Adaptor-Carrier Quad Flatpack to Pin Grid Array Sockets for Use in Electroinc Equipment | 09/28/2011 | CE-2.0 | EIA-540ADAA | |
| PN-5236.07 | Specification for Small Form Factor 33.0 mm (1.3in) Disk Drives | 09/28/2011 | CE-2.0 | EIA-675 | |
| PN-5236.06 | Connectors, Electrical Flat Cable Type-IPC FC-218B | 09/28/2011 | CE-2.0 | EIA-429 | |
| PN-5236.05 | General Document for Connectors, Electric, Printed-Wiring Board-IPC-C-405A | 09/28/2011 | CE-2.0 | EIA-406 | |
| PN-5236.04 | Electrical Connectors, Small Contact Standard for | 09/28/2011 | CE-2.0 | EIA-380-A | |
| PN-5236.03 | Cable Connectors for Audio Facilities for Radio Broadcasting- Correction Sheet | 09/28/2011 | CE-2.0 | EIA-297-A | |
| PN-5236.02 | Solderless Wrapped Electrical Connections | 09/28/2011 | CE-2.0 | EIA-280-C | |
| PN-5236.01 | Tools, Crimping, Solderless Wiring Devices | 09/28/2011 | CE-2.0 | EIA-270 | |
| PN-5236 | Designate 18 docs as 'EIA Stabilized Standards' | 09/28/2011 | CE-2.0 | ||
| PN-5235 | Carrier Taping 2mm Camber Limit | 09/22/2011 | ACH | Component Bulletin | |
| PN-5234 | Carrier Taping of Surface Mount Components for Automatic Handling | 09/22/2011 | ACH | EIA-481-E | |
| PN-5233 | Resistive Devices Handbook | 09/20/2011 | P-2.1 | Revised Publication | |
| PN-5232 | Defining "Low-Halogen" Passives and Solid State Devices | 09/20/2011 | S-1 | JS709A | |
| PN-5231 | Rework Resistance to Soldering Heat Test Procedure for Electrical Connectors and Sockets | 09/14/2011 | CE-2.0 | EIA-364-61 | |
| PN-5230 | Dust (Fine Sand) Test Procedure for Electrical Connectors | 07/05/2011 | CE-2.0 | EIA-364-50B | |
| PN-5229 | Impact Test Procedure for Electrical Connectors | 07/05/2011 | CE-2.0 | EIA-364-42C | |
| PN-5228 | Insert Retention Test Procedure for Electrical Connectors | 07/05/2011 | CE-2.0 | EIA-364-35C | |
| PN-5227 | Aire Leakage Test Procedure for Electrical Connectors | 07/05/2011 | CE-2.0 | EIA-364-02D | |
| PN-5226.12 | Propogation Delay Test Procedure for Electrical Connectors, Sockets, Cable Assemblies or Interconnection Systems | 06/30/2011 | CE-2.0 | EIA-364-103 | |
| PN-5226.11 | Rise Time Degradation Test Procedure for Electrical Connectors Sockets, Cable Assemblies or Interconnection Systems | 06/30/2011 | CE-2.0 | EIA-364-102 | |
| PN-5226.10 | Marking Permanence Test Procedure for Electrical Connectors and Sockets | 06/30/2011 | CE-2.0 | EIA-364-100A | |
| PN-5226.09 | Gage Location and Retention Test Procedure for Electrical Connectors | 06/30/2011 | CE-2.0 | EIA-364-99 | |
| PN-5226.08 | Full Mating and Mating Stability Test Procedure for Electrical Connectors | 06/30/2011 | CE-2.0 | EIA-364-95 | |
| PN-5226.07 | Magnetic Permeability Test Procedure for Electrical Connectors, Contacts and Sockets | 06/30/2011 | CE-2.0 | EIA-364-54A | |
| PN-5226.06 | Microsecond Discontinuity Test Procedure for Electrical Connectors and Sockets | 06/30/2011 | CE-2.0 | EIA-364-46C | |
| PN-5226.05 | Low Level Contact Resistance Test Procedure for Electrical Connectors and Sockets | 06/30/2011 | CE-2.0 | EIA-364-23C | |
| PN-5226.04 | Contact Strength Test Procedure for Electrical Connectors | 06/30/2011 | CE-2.0 | EIA-364-15A | |
| PN-5226.03 | Ozone Exposure Test Procedure for Electrical Connectors | 06/30/2011 | CE-2.0 | EIA-364-14B | |
| PN-5226.02 | Durability Test Procedure for Electrical Connectors and Contacts | 06/30/2011 | CE-2.0 | EIA-364-09C | |
| PN-5226.01 | Contact Resistance Test Procedure for Electrical Connectors | 06/30/2011 | CE-2.0 | EIA-364-06C | |
| PN-5225 | Test Procedure for High-Frequency Characterization of Low Inductance Multilayer Ceramic Chip Capacitors | 04/04/2011 | P-2.1 | TBD | |
| PN-5224 | Multilayer (Monolithic), Unencapsulated, Ceramic Dielectric, Surface-Mount Low Inductance Chip Capacitors And Multi-Terminal Low Inductance Capacitors | 03/25/2011 | P-2.1 | EIA-198 III /10 | |
| PN-5223 | Joint Standards Project On Low Halogen Compounds | 03/14/2011 | S-1 | TBD | |
| PN-5222 | Reaffirmation of Component Tray Standard | 03/14/2011 | ACH | EIA-948 | |
| PN-5221 | Solderability Tests for Component Leads, Terminations, Lugs, Terminals, And Wires | 02/25/2011 | STC | J-STD-002D | |
| PN-5220 | Resistance to Soldering Heat | 02/22/2011 | CE-2.0 | EIA-364-56E | |
| PN-5219 | Coupling Pins Strength for Circular Bayonet Electrical Connectors | 02/21/2011 | CE-2.0 | EIA-364-57 | |
| PN-5218 | Ultraviolet Radiation Test Procedure For Electrical Connectors and Sockets | 01/06/2011 | CE-2.0 | EIA-364-49 | |
| PN-5217 | Standard Test Method for Destructive Physical Analysis (DPA) of Ceramic Monolithic Capacitors. | 12/02/2010 | P-2.1 | EIA-469-E | |
| PN-5216 | Thermal Shock (Temperature Cycling) Test Procedure for Electrical Connectors and Sockets | 11/05/2010 | CE-2.0 | EIA-364-32F | |
| PN-5215 | Mating and Unmating Force Test Procedure for Electrical Connectors and Sockets | 10/23/2010 | CE-2.0 | EIA-364-13E | |
| PN-5214 | Assembly Component Tray – ACT | 08/16/2010 | ACH | EIA-960-A | |
| PN-5213 | Mechanical Shock (Specified Pulse) Test Procedure for Electrical Connectors and Sockets | 07/13/2010 | CE-2.0 | EIA-364-27C | |
| PN-5212 | Vibration Test Procedure for Electrical Connectors and Socketss | 07/13/2010 | CE-2.0 | EIA-364-28F | |
| PN-5211 | Ambient Condensation Test Procedure for Electrical Connector and Sockets | 06/08/2010 | CE-2.0 | EIA-364-34 | |
| PN-5210 | Humidity Test Procedure for Electrical Connectors and Sockets | 06/08/2010 | CE-2.0 | EIA-364-31D | |
| PN-5209 | Electrochemical Double Layer Capacitors (EDLCs), Cylindrical Single-cell | 06/03/2010 | P-2.7 | EIA-969 | |
| PN-5208 | TEST PROCEDURES FOR ELECTRICAL CONNECTORS AND SOCKETS | 05/20/2010 | CE-2.0 | N/A | |
| PN-5207 | Coupling and Uncoupling Force Test Procedure for Electrical Connectors | 05/16/2010 | CE-2.0 | EIA-364-114 | |
| PN-5205 | Cavity-to-Cavity Leakage Bonding Integrity Test Procedure for Electrical Connectors | 01/25/2010 | CE-2.0 | EIA-364-78B | |
| PN-5204 | Corrosivity of Contacts Test Procedure for Electrical Connector and Socket | 12/08/2009 | CE-2.0 | EIA-364-113 | |
| PN-5203 | Fretting Corrosion Test Sequence for Electrical Connectors and Sockets | 12/08/2009 | CE-2.0 | EIA-364-1005 | |
| PN-5202 | Specification for Micro Serial Attached SCSI (SAS) Connector | 11/29/2009 | CE-2.0 | EIA-967 | |
| PN-5201 | Specification for Unshielded Dual Port Serial Attachment Connector | 11/20/2009 | CE-2.0 | EIA-966 | |
| PN-5200 | Probe Damage Test Procedure for Electrical Connectors | 10/22/2009 | CE-2.0 | EIA-364-25D | |
| PN-5199 | Shell - to - Shell Conductivity Test Procedure for Electrical Connectors | 10/17/2009 | CE-2.0 | EIA-364-83A | |
| PN-5198 | Integrated Passive Device (IPD) Definitions | 10/14/2009 | P-10 | CB-16 | |
| PN-5197 | Integrated Passive Device (IPD) Chipscale Package Design Guidelines | 10/14/2009 | P-10 | EIA-800 | |
| PN-5196 | Integrated Passive Devices Product Registrations | 10/14/2009 | P-10 | EIA-850 | |
| PN-5192 | THICK FILM RESISTOR SPECIFICATION | 06/16/2009 | P-1 | EIA-575 B | |
| PN-5191 | DETAIL SPECIFICATION FOR MINI MULTILANE SHIELDED INTEGRATED CONNECTOR | 06/11/2009 | CE-2.0 | EIA-965 | |
| PN-5190 | DETAIL SPECIFICATION FOR QSFP+ COPPER AND OPTICAL MODULES | 06/11/2009 | CE-2.0 | EIA-964 | |
| PN-5189 | FIREWALL FLAME TEST PROCEDURE FOR ELECTRICAL CONNECTORS | 06/04/2009 | CE-2.0 | EIA-364-45B | |
| PN-5188 | LOW FREQUENCY SHIELDING EFFECTIVENESS TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | 06/03/2009 | CE-2.0 | EIA-364-80A | |
| PN-5187 | RESIDUAL MAGNETISM TEST PROCEDURE FOR ELECTRICAL CONNECTORS | 06/02/2009 | CE-2.0 | EIA-364-88A | |
| PN-5186 | TEST PROCEDURES FOR ELECTRICAL CONNECTORS | 06/02/2009 | CE-2.0 | EIA-364-51 | |
| PN-5183 | ENVIRONMENTAL TEST METHODOLOGY FOR ASSESSING THE PERFORMANCE OF ELECTRICAL CONNECTORS AND SOCKETS USED IN CONTROLLED ENVIRONMENT APPLICATIONS | 11/09/2008 | CE-2.0 | EIA-364-1000.01B | |
| PN-5182 | FIXED FILM DIELECTRIC CAPACITORS, STACKED METALLIZED CHIP CAPACITORS | 11/05/2008 | P-2.2 | TBD | |
| PN-5181 | NANOSECOND EVENT DETECTION TEST PROCEDURE FOR ELECTRICAL CONNECTORS, CONTACTS AND SOCKETS | 09/26/2008 | CE-2.0 | EIA-364-87A | |
| PN-5180 | CABLE FLEXING TEST PROCEDURE FOR ELECTRICAL CONNECTORS | 09/26/2008 | CE-2.0 | EIA-364-41E | |
| PN-5179 | EFFECTIVE RESISTANCE OF PARALLEL CIRCUITS TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | 07/30/2008 | CE-2.0 | EIA-364-112 | |
| PN-5178 | LEAD TAPING OF COMPONENTS IN THE RADIAL CONFIGURATION FOR AUTOMATIC HANDLING | 05/15/2008 | ACH | EIA/ECA-468-C | |
| PN-5177 | ALTITUDE IMMERSION TEST PROCEDURE FOR ELECTRICAL CONNECTORS | 05/01/2008 | CE-2.0 | EIA-364-03C | |
| PN-5176 | TEST PROCEDURES FOR ELECTRICAL CONNECTORS AND SOCKETS | 04/28/2008 | CE-2.0 | EIA-364-04A | |
| PN-5175 | LIGHTNING STRIKE TEST PROCEDURE FOR ELECTRICAL CONNECTORS | 04/14/2008 | CE-2.0 | EIA-364-75 | |
| PN-5174 | Environmental Test Methodology for Verifying and Current Rating of Free-Standing Power Contacts of Electrical Connectors and Sockets | 11/27/2007 | CE-2.0 | EIA-364-1004 | |
| PN-5171 | ELECTRICAL CONNECTOR / SOCKET TEST PROCEDURES INCLUDING ENVIRONMENTAL CLASSIFICATIONS | 06/21/2007 | CE-2.0 | EIA-364E | |
| PN-5170 | CABLE FLEXING TEST PROCEDURE FOR ELECTRICAL CONNECTORS | 06/18/2007 | CE-2.0 | EIA-364-41D | |
| PN-5169 | CABLE PULL-OUT TEST PROCEDURE FOR ELECTRICAL CONNECTORS | 06/18/2007 | CE-2.0 | EIA-364-38C | |
| PN-5168 | THERMAL SHOCK (Temperature Cycling) TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | 06/18/2007 | CE-2.0 | EIA-364-32E | |
| PN-5167 | TEST PROCEDURES FOR ELECTRICAL CONNECTORS AND SOCKETS | 06/07/2007 | CE-2.0 | EIA-364-19 | |
| PN-5166 | FLUID IMMERSION TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | 05/14/2007 | CE-2.0 | EIA-364-10E | |
| PN-5165 | CHINA RoHS ENVIRONMENTAL FRIENDLY USE PERIOD (EFUP) MARKING REQUIREMENTS | 05/23/2007 | S-1 | CB-24 | |
| PN-5164 | TEST PROCEDURE FOR DETERMINING THE TOTAL IONIC CONTAMINATION OF AN ELECTRICAL CONNECTOR OR SOCKET ASSEMBLY OR COMPONENT | 04/06/2007 | CE-2.0 | EIA-364-111 | |
| PN-5163 | ALTITUDE - LOW TEMPERATURE TEST PROCEDURE FOR ELECTRICAL CONNECTORS | 03/23/2007 | CE-2.0 | EIA-364-105A | |
| PN-5162 | CONTACT AXIAL CONCENTRICITY TEST PROCEDURE FOR ELECTRICAL CONNECTORS | 01/19/2007 | CE-2.0 | EIA-364-07C | |
| PN-5161 | INSULATION RESISTANCE TEST PROCEDURE FOR ELECTRICAL CONNECTORS, SOCKETS, AND COAXIAL CONTACTS | 01/19/2007 | CE-2.0 | EIA-364-21D | |
| PN-5160 | WITHSTANDING VOLTAGE TEST PROCEDURE FOR ELECTRICAL CONNECTORS, SOCKETS, AND COAXIAL CONTACTS | 01/19/2007 | CE-2.0 | EIA-364-20D | |
| PN-5159 | MATERIAL COMPOSITION DECLARATION FOR ELECTRONIC PRODUCTS | 01/05/2007 | EIA/EIC JIG | JIG-101A | |
| PN-5158 | RESISTANCE TO SOLDERING HEAT TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | 11/30/2006 | CE-2.0 | EIA-364-56D | |
| PN-5157 | MATING AND UNMATING FORCE TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | 11/30/2006 | CE-2.0 | EIA-364-13D | |
| PN-5156 | TEMPERATURE LIFE WITH OR WITHOUT ELECTRICAL LOAD TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | 11/03/2006 | CE-2.0 | EIA-364-17C | |
| PN-5155 | AXIAL-LEADED, GLASS ENCAPSULATED CAPACITORS | 10/25/2006 | P-2.1 | EIA 198 Part III Section 7 | |
| PN-5154 | AXIAL-LEADED CAPACITORS, CONFORMALLY COATED AND MOLDED TYPES | 10/25/2006 | P-2.1 | EIA 198 Part III Section 6 | |
| PN-5153 | RADIAL-LEADED CAPACITORS, COMFORMALLY COATED AND MOLDED TYPES | 10/25/2006 | P-2.1 | EIA 198 Part III Section 4 | |
| PN-5152 | RADIAL-LEADED, MOLDED CAPACITORS | 10/25/2006 | P-2.1 | EIA-198 Part III Section 5 | |
| PN-5151 | HIGH VOLTAGE MULTILAYER CAPACITORS | 10/25/2006 | P-2.1 | EIA 198 Part III Section 9 | |
| PN-5150 | HUMIDITY TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | 09/09/2006 | CE-2.0 | EIA-364-31C | |
| PN-5149 | ASSEMBLY PROCESSING, EVALUATION AND CLASSIFICATION OF Non-IC ELECTRONIC COMPONENTS | 09/26/2006 | S-1 | TBD | |
| PN-5143 | ENVIRONMENTAL TEST METHODOLOGY FOR ASSESSING THE PERFORMANCE OF ELECTRICAL CONNECTORS AND SOCKETS USED IN CONTROLLED ENVIRONMENT APPLICATIONS | 06/20/2006 | CE-2.0 | EIA-364-1000 | |
| PN-5142 | TEST PROCEDURES FOR ELECTRICAL CONNECTORS AND SOCKETS | 06/09/2006 | CE-2.0 | TBD | |
| PN-5141 | SOLDERABLILTY TESTS FOR COMPONENT LEADS, TERMINATION, LUGS, TERMINALS AND WIRES | 05/19/2006 | STC | J-STD-002C | |
| PN-5138 | SOLID TANTALUM CAPACITOR IN MICROMINI CASES | 05/10/2006 | P-2.5 | 941-A | |
| PN-5137 | SOLID TANTALUM CAPACITOR MOLDED CASE WITH FACEDOWN TERMINATIONS | 05/10/2006 | P-2.5 | TBD | |
| PN-5136 | MATING AND UNMATING FORCE TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | 01/26/2006 | CE-2.0 | EIA-364-13C | |
| PN-5135 | CAPACITOR STANDARD FOR IC ENGINE CRANKING | 02/07/2006 | KFI | TBD | |
| PN-5134 | THERMAL SHOCK (Temperature Cycling) TEST PROCDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | 01/23/2006 | CE-2.0 | EIA-364-32D | |
| PN-5133 | ENVIRONMENTAL ACCEPTANCE REQUIREMENTS FOR WHISKER SUSCEPTIBILITY OF Pb-FREE ALLOY SURFACE FINISHES |
01/19/2006 | S-1 | EIA/ECA CB23 | |
| PN-5130 | MECHANICALLY-INTERLOCKED COMPONENT PACKAGING FOR AUTOMATIC HANDLING | 01/18/2006 | ACH | EIA-704-A | |
| PN-5129 | BARE DIE AND CHIP SCALE PACKAGES TAPED IN 8mm & 12mm CARRIER TAPE FOR AUTOMATIC HANDLING | 01/18/2006 | ACH | EIA-763-A | |
| PN-5128 | 8mm PUNCHED & EMBOSSED CARRIER TAPING OF SURFACE MOUNT COMPONENTS FOR AUTOMATIC HANDILING OF DEVICES GENERALLY SMALLER THAN 20.mm x 1.2 mm | 01/18/2006 | ACH | EIA-726-A | |
| PN-5127 | WIRE BENDING TEST PROCEDURE FOR INSULATION DISPLACEMENT CONTACTS (IDC) FOR ELECTRICAL CONNECTORS |
12/13/2005 | CE-2.0 | EIA-364-92 | |
| PN-5126 | POLARIZING/CODING KEY OVERSTRESS TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | 12/13/2005 | CE-2.0 | EIA-364-86 | |
| PN-5125 | VIBRATION TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | 11/10/2005 | CE-2.0 | EIA-364-28E | |
| PN-5124 | RESISTANCE TO SOLDERING HEAT TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | 11/29/2005 | CE-2.0 | EIA-364-56C | |
| PN-5123 CANCELLED |
Ball Grid Array (BGA) and Land Grid Array (LGA) Test Sequence for Electrical Connectors and Sockets | 10/10/2005 | CE-2.0 | EIA-364-1003 | |
| PN-5122 | INTEGRATED PASSIVE DEVICE PRODUCT REGISTRATIONS EIA-850 | 10/25/2005 | P-10 | EIA-850-A | |
| PN-5121 | INTEGRATED PASSIVE DEVICE (IPD) CHIPSCALE PACKAGE DESIGN GUIDELINES EIA-800 | 10/25/2005 | P-10 | EIA-800-A | |
| PN-5120 | IPD APPLICATION GUIDELINE |
10/13/2005 | P-10 | EIA/ECA 957-A | |
| PN-5119 | ARCHIVE THE FOLLOWING STANDARDS: EIA-172-B, EIA-460, EIA-196-A, EIA-396, EIA-451, EIA-452 | 9/21/2005 | P-1 | N/A | |
| PN-5118 | COMMENTS ON TEST METHODS AND CRITERIA FOR TIN WHISKERS IN SURFACE MOUNT PASSIVE DEVICES | 9/21/2005 | S-1 | CB-22 | |
| PN-5117 | CORRECTION TO EIA 481 | 9/21/2005 | S-1 | CB-20 | |
| PN-5116 | ECA GUIDELINE: COUNTERFEIT PASSIVE COMPONENTS | 9/21/2005 | S-1 | CB-21 | |
| PN-5115 | HAVE YOU SEEN TIN WHISKERS? THE FACTS ABOUT TIN WHISKERS | 9/21/2005 | S-1 | CB-19A | |
| PN-5114 | ELECTRICAL SOCKET SPECIFICATIONS | 7/7/2005 | CE-2.0 | EIA-540C000, 540CA00, 540CAAA, 540CAAB | |
| PN-5113 | LIGHTNING STRIKE TEST FOR ELECTRICAL CONNECTORS | 7/24/2005 | CE-2.0 | EIA-364-75 | |
| PN-5112 | ELECTRICAL SOCKET SPECIFICATIONS | 7/13/2005 | CE-2.0 | ||
| PN-5111 | LOW TEMPERATURE TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | 7/01/2005 | CE-2.0 | EIA-364-59A | |
| PN-5110 | CONTACT STRENGTH TEST PROCEDURE FOR ELECTRICAL CONNECTORS | 7/01/2005 | CE-2.0 | EIA-364-15A | |
| PN-5109 | VISUAL AND DIMENSIONAL INSPECTION TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | 7/01/2005 | CE-2.0 | EIA-364-18B | |
| PN-5106 | CONTACT RESISTANCE TEST PROCEDURE FOR ELECTRICAL CONNECTORS | 6/11/2005 | CE-2.0 | EIA-364-06C | |
| PN-5105 | LOW LEVEL CONTACT RESISTANCE TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | 6/11/2005 | CE-2.0 | EIA-364-23C | |
| PN-5104 | SURFACE MOUNT COMMAND MODE CHOKE | 6/2/2005 | P-3 | EIA-958 | |
| PN-5103 | FLUID IMMERSION TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | 5/31/2005 | CE-2.0 | EIA-36410D | |
| PN-5100 | VISUAL AND MECHANICAL INSPECTION FOR MOLDED SOLID TANTALUM CHIP CAPACITORS | 5/18/2005 | P-2.5 | EIA-757-A | |
| PN-5099 | SMD MULTILAYER CERAMIC CHIP CAPACITORS | N/A | P-2.1 | EIA-198-E III/3 | |
| PN-5098 | SOLID TANTALUM CAPACITOR APPLICATION GUIDELINE | 5/18/2005 | P-2.5 | EIA-809A | |
| PN-5097 | SURFACE MOUNT TANTALUM CAPACITOR QUALIFICATION SPECIFICATION | 5/18/2005 | P-2.5 | EIA-717-A | |
| PN-5095 | ANSI/EIA 521: APPLICATION GUIDE FOR MULTILAYER CERAMIC CAPACITORS - ELECTRICAL | N/A | P-2.1 | ANSI/EIA - 521 | |
| PN-5094 | VISUAL AND MECHANICAL INSPECTION MULTILAYER CERAMIC CHIP CAPACITORS | 5/16/2005 | P-2.1 | EIA-595 A | |
| PN-5093 | NEW STANDARD THIN FILM ON SILICON RESISTOR NETWORK SPECIFICATION | 5/12/2005 | P-1 | TBA | |
| PN-5092 | REVISION ON EIA/IS-703 | 5/12/2005 | P-1 | EIA-703-A | |
| PN-5091 | REVISION ON EIA-887 | 5/12/2005 | P-1 | TBA | |
| PN-5090 | REVISION ON EIA-886 | 5/12/2005 | P-1 | TBA | |
| PN-5089 | CURRENT CYCLING TEST FOR ELECTRICAL CONNECTORS | 4/20/2005 | CE-20 | EIA/ECA-364-55A | |
| PN-5088 | ASSEMBLY COMPONENT TRAY-ACT | 8/13/2004 | ACH | EIA-960 | |
| PN-5087 | ELECTRICAL AND ELECTRONIC COMPONENT HAZARDOUS SUBSTANCE FREE STANDARD AND REQUIREMENTS | 3/7/2005 | ECCB | EIA/ECCB-954 | |
| PN-5086 | REVISION OF EIA-364-89A | 3/3/2005 | CE-2.0 | TBA | |
| PN-5085 | REVISION OF EIA-364-46B | 3/3/2005 | CE-2.0 | EIA-364-46C | |
| PN-5084 | REVISION OF EIA-364-36B | 3/3/2005 | CE-2.0 | EIA-364-36C | |
| PN-5083 | REAFFIRMATION OF 17 364 TP's | 2/20/2005 | CE-2.0 | TBA | |
| PN-5082 | TRAY STANDARD | 10/13/2004 | ACH | TBA | |
| PN-5081 | NON-CONVENTIONAL SMALL PITCH & WIDTH | 10/13/2004 | ACH | TBA | |
| PN-5080 | WAVE AND CAMBER | 10/13/2004 | ACH | TBA | |
| PN-5079 | NIOBIUM CAPS | 10/13/2004 | P-2.5 | TBA | |
| PN-5078 | UPGRADE IS-717 | 10/13/2004 | P-2.5 | EIA-717 | |
| PN-5077 | REVISION OF EIA-809 | 10/13/2004 | P-2.5 | EIA-809-A | |
| PN-5076 | COMBINE EIA-535BAAC & EIA-535BAAE | 10/13/2004 | P-2.5 | TBA | |
| PN-5075 | NIOBIUN CAPS | 10/13/2004 | P-14 | TBA | |
| PN-5074 |
USER'S APPLICATION GUIDE TO FUSES | 10/28/2004 |
P-14 |
TBA |
|
| PN-5073 |
LOW VOLTAGE SUPPLEMENTAL FUSE QUALIFICATION SPECIFICATION |
10/28/2004 |
P-14 |
TBA |
|
| PN-5072 |
SURGE WITHSTAND TELECOMMUNICATIONS FUSE QUALIFICATION SPECIFICATION |
10/28/2004 |
P-14 |
TBA |
|
| PN-5071 | METALLIC COATING THICKNESS MEASUREMENT OF CONTACTS TEST PROCEDURE FOR ELECTRICAL CONNECTORS | 8/27/2004 | ECA CE-2.0 | EIA-364-48A | |
| PN-5070 | ENGINEERING SPECIFICATION FOR CACUUM GRADE MONEL ALLOY 404 (UNS N40400) FOR VACUUM ELECTRON DEVICES | 8/17/2004 | ECA MVED | EIA/ECA-951 | |
| PN-5069 | ENGINEERING SPECIFICATION FOR VACUUM GRADE 70 COPPER 3 NICKEL ALLOY OF VACUUM ELECTRON DEVICES | 8/17/2004 | ECA MVED | EIA/ECA-950 | |
| PN-5068 | ENGINEERING SPECIFICATION FOR METALLIZED BERYLLIUM OXIDE CERAMICS | 8/17/2004 | ECA MVED | EIA/ECA-949 | |
| PN-5067 | STANDARD FOR PLANS TO DETERMINE LEAD CONTENT OF ELECTRONIC COMPONENTS AND RELATED EQUIPMENT | 8/13/2004
Published SEP 2004 |
ECCB TPC-1 | EIA/ECCB-952 | |
| PN-5065 | RESISTANCE TO SOLVENTS TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS | 8/4/2004 | ECA CE-2.0 | EIA-364-11B | |
| PN-5047 | MATERIALS COMPOSITION DECLARATION GUIDE | 1/23/2003 | EIA MDG-1 | TBA | |
| PN-4996 | QUALIFICATION SPECIFICATION FOR DIE LEVEL NETWORKS WITH SOLDER BUMP INTERCONNECTS | 1/02/2002 | P-10 | EIA-961 |