ECIA / NEDA Guidelines and Position Papers

The Guidelines and Position Papers have been developed over the years through the efforts of member companies working together to make the industry more efficient and effective. These documents include best practices, defined "standards", and industry position on various topics.
 

Association Position and White Papers

 

Guidelines:

• EDI Transaction Set 850 - Purchase Order
• EDI Transaction Set 855 - Purchase Order Acknowledgement
• EDI Transaction Set 860 - Purchase Order Change Request - Buyer Initiated
• EDI Transaction Set 865 - Purchase Order Change Acknowledgement - Seller Initiated
• NIGP 101.01: Guidelines for Commercial Semiconductor Packaging and Labeling
  • Superseded by JEP 130
• NIGP 102: Guidelines for Unit Packing for Integrated Circuits - Tubes (Rails)
• Superseded By JEP 130
• NIGP 103: Guidelines for Identification and Labeling of Moisture Sensitive Integrated Circuits
  • Superseded by JEP 113-XX
• NIGP 104: Guidelines for the Packing and Handling of Moisture Sensitive Integrated Circuits
  • Superseded by JEP 124
• NIGP 105: Handling Guidelines for Moisture Sensitive Plastic Surface Mount Components
  • Superseded by JEP 124
• NIGP 106b: Handling Guidelines for the Transference of Tray-Packaged ICs
• NIGP 107: Guidelines for the Format of Military Certificates of Conformance
• NIGP 108: Guidelines for Packing & Dunnage of Electronic Components
• NIGP 109: Guidelines for Distributor Assessment of Manufacturer Performance
• NIGP 110: Technical Guidelines for Electronic Price/Sales Catalog
• NIGP 111: Guidelines for the Format of Packing Slips
• NIGP 112: NEDA Guidelines for Auto Identification
  (1-Dimensional Bar Code & 2-Dimensional Matrix Code for Suppliers
  Product Package & Shipment Labeling)
• NIGP 113: NEDA Guidelines for Product Returns
• NEDA Guidelines for Effective Vendor Sales Meetings
• NEDA Customer Notice