Soldering Technology Committee
Committee Scope: The STC encompasses soldering practices (soldering iron-mass reflow techniques) and associated soldering materials (solders, pastes and adhesives, and flux/cleaning agents). However, the Committee will focus on solderability test method development for printed through-hole (PTH) and surface mountable components. One of the major functions is to promote commonality and standardization of soldering test methodology within the EIA Sectors.
Committee Chairman: Doug Romm, Texas Instruments Inc.
| Meeting Date | Notice | Agenda | Roster | Minutes | Attachments |
| September 28, 2010 | 09/28 | DOE Report (PowerPoint) J-STD Draft (PDF) |
| Meeting Date | Notice | Agenda | Roster | Minutes | Attachments |
| September 28, 2010 | 09/28 | DOE Report (PowerPoint) J-STD Draft (PDF) |
|||
| April 27, 2010 | 04/27 | 04/27 | |||
| October 7, 2009 | 10/07 (PDF) | 10/07 (PDF) | DOE Report (PowerPoint) | ||
| April 29, 2009 | 04/29 (PDF) | ||||
| October 8, 2008 | 10/08 (PDF) | 10/08 (PDF) | IPD Midwest Slideshow IEC Test Method |
||
| March 31 - April, 3 2008 | 03/31-04/03 (PDF) | 03/31-04/03 (PDF | DOE Report (PowerPoint) | ||
| September 25, 2007 | 09/25 (PDF) | 09/25 (PDF) | Spec. Comparison (Excel) | ||
| April 17, 2007 | 04/17 (PDF) | 04/17 (PDF) | |||
| September 26, 2006 | 09/26 (PDF) | ||||
| April 27, 2006 | 04/27 (PDF) | 04/27 (PDF) | |||
| October 17-20, 2005 | 10/18 (PDF) | 10/18 (PDF) | |||
| May 17, 2005 | 05/17 (PDF) | 05/17 (PDF) | |||
| October 5, 2004 | 10/05 (PDF) | 10/05 (PDF) | Shell
Life Study Test Plan Revision |
||
| April 20, 2004 | 04/20 (PDF) | 04/20 (PDF) |