Committees
OrganizationECIA's Engineering Committees develop and maintain standards for the electronic components industry. Committees meet semi-annually during ECIA Engineering Spring and Fall Summits, and as needed, throughout the year. Active Committees are currently developing new standards or are revising current standards. Inactive Committees have no current agenda but maintain previously published standards.
Agendas for upcoming meetings and minutes for previous meetings are listed for each active committee. In addition, the scope, chairperson and roster are listed for each of these committee. A list of standards and projects for each committee can also be accessed along with the ability to update individual profiles or register to receive information on each active committee's activities.
Active Standards Committees
P-1 Resistive Devices
P-2.1 Ceramic Dielectric Capacitors
P-2.2 Paper, Film, Mica & Wet-Electrolytic Capacitors
P-2.5 Solid Electrolytic Capacitors
P-2.7 Electromechanical Double-layer Capacitors
P-3 Inductive Components
P-4 Mechanical Outlines
P-10 Integrated Passive Devices
P-14 Overcurrent Protection Devices
CE-2.0 National Connector and Socket Standards
CE-4.0 RF Connectors
CE-4.1 Ridgid Coax S-1 Committee (formerly U-1)
S-1 Passive Component Committees Steering Group
Automated Component Handling
Soldering Technology
STPC Standards Library
(password required)
EIA 364 